MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202647077275 A) filed by Rapidus Corporation on June 23, 2026, for Electronic Device. Inventor includes Nonaka... Read More
MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202647077312 A) filed by Qualcomm Incorporated on June 23, 2026, for Package Comprising A Base Portion And Inte... Read More
MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202647077313 A) filed by Qualcomm Incorporated on June 23, 2026, for Enhanced Integrated Circuit Heat Dissipati... Read More
MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202647077321 A) filed by Qualcomm Incorporated on June 23, 2026, for Scaffold Stiffener Embedded In Substrate. ... Read More
MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202647077348 A) filed by Nuvoton Technology Corporation Japan on June 23, 2026, for Rendering Display System, R... Read More
MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202647077395 A) filed by Telefonaktiebolaget Lm Ericsson Publ on June 23, 2026, for Methods And Means For Assis... Read More
MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202647077420 A) filed by Trinseo Europe Gmbh on June 23, 2026, for Water-Based Copolymer Emulsion With Regenera... Read More
MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202647077423 A) filed by Nokia Solutions And Networks Oy on June 23, 2026, for Coordination For Mitigating Cros... Read More
MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202647077424 A) filed by Qualcomm Incorporated on June 23, 2026, for Package Comprising Integrated Devices And ... Read More
MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202647077445 A) filed by Qualcomm Incorporated on June 23, 2026, for Package Comprising A Substrate And A Passi... Read More